The following numerical
methodologies are used for product analysis/simulation:
Parametric Finite Element Analysis (FEA) Product performance
analysis can be conducted
for linear and nonlinear physical systems exhibiting Static &
Dynamic Mechanics,Thermal (Heat Transfer), EMC/EMI,
and Coupled Field phenomenon.
Integrated Parametric FEA
&Design of Experiments (DOE) Product design
optimization using response surface methods.
Computational Fluid Dynamics (CFD) Product evaluation using
fluid flow & heat transfer analysis.
Web-based
thermal analysis tools - developed by CEA Group for first-order
thermal analysis.
Computational Tools for analysis and simulation include the
following:
ANSYS Multiphysics General Purpose Finite Element Software
Including: LS-DYNA 3D (drop, impact & large deformation
analyses).